EDN

AI workloads demand smarter SoC interconnect design

Instead of manually placing every switch, buffer, and timing pipeline stage, engineers can now use automation algorithms to ...
EDN

Interconnect underdogs steering chiplet design bandwagon

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California ...
Semiconductor Engineering

An Explosion In Interconnect Complexity

Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...
Design And Reuse

Lightmatter and Cadence Collaborate to Accelerate Optical Interconnect for AI Infrastructure

Technical collaboration leverages Cadence AI/HPC IP in next-generation optical engines for hyperscale AI data centers. MOUNTAIN VIEW, Calif. – Lightmatter, the ...
Electronic Design

Interconnect Manages Power And Data Flow

As systems-on-a-chip (SoCs) bring more functionality onto the chip itself, data flow becomes a daunting issue. To confront this design problem, Sonics, Inc. has come out with the SonicsMX solution.
Seeking Alpha

Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design

CAMPBELL, Calif., Sept. 10, 2024 (GLOBE NEWSWIRE) -- Arteris, Inc. (AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that VeriSilicon (688521.SH), ...
Electronic Design

Interconnect-Driven Design Suits Suite For Analog, RF IC Designs

The Analog Office software is intended for use with next-generation analog and radio-frequency integrated-circuit (RF IC) designs focused on total RF closure. The solution leverages concurrent ...
PC Gamer

Intel claims its optical interconnect chiplet technology is 'like going from using horse-drawn carriages to using cars and trucks'

It can deliver 4Tbps of bandwidth from 100m away. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. At the Optical Fiber Communications Conference ...
Semiconductor Engineering

2024 Set The Stage For NoC Interconnect Innovations In SoC Design

What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed the boundaries of system-on-chip (SoC) design. A game-changing new ...

Heilind Features Molex SideWize High-Voltage Connectors for Space-Constrained Interconnect Designs

Heilind expands its Molex portfolio by adding SideWize High-Voltage Connectors—providing customers with enhanced performance, ...
NBC4 Columbus

Lisconn: A New Name In Innovative, Global Interconnect Component Design & Manufacturing for Highly Regulated Electronics

Merger of 3 High-Tech Companies with US Equity Backing Creates One-Stop-Shop for Specialist Interconnect Solutions & Electronics Manufacturing Services Lisconn’s value lies in delivering high ...
HotHardware

Apple M3 Ultra May Ditch UltraFusion Interconnect For A Monolithic Design

Apple has taken what appears to be a logical approach to its Apple silicon releases. First, it will disperse onto its hardware the more basic iterations, such as the M3 Pro, and M3 Max. Next, it will ...