Semiconductor Engineering

Wafer Probe Struggles To Adapt To Multi-Die Assemblies

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.
Semiconductor Engineering

DRAM Test And Inspection Just Gets Tougher

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...
CNN

FormFactor Presents New Wafer Probe Test Technologies at SWTest Asia

LIVERMORE, Calif., Oct. 16, 2019 (GLOBE NEWSWIRE) -- FormFactor, Inc. (NASDAQ: FORM), an industry-leading electrical test and measurement supplier to the semiconductor industry, will showcase new ...

PI Introduces Miniaturized Alignment Engine Platform for Scalable, Parallel E/O Wafer-Level Test

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing.
Business Insider

Aehr Receives Follow-on Order for FOX-XP™ Wafer Level Test and Burn-in System for High Volume Production of Silicon Photonics Devices

FREMONT, Calif., April 04, 2019 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced that it has received a $2.1 ...